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WEBWASHINGTON – Global semiconductor industry sales hit $51.3 billion in July, an increase of 18.7% compared to the July 2023 total of $43.2 bi... BANGKOK – Cal-Comp Electronics reported sales of $975.1 million for the second quarter, a decrease of 10.6% from the same quarter last year.... ROSHEIM, FRANCE – French electronics manufacturer ...
Verifying PCBA Cleanliness with Ion Chromatography - Circuits …
WEBFeb 14, 2017 — Ion chromatography is a tool to analyze and verify PCBA cleanliness. One benefit of ion chromatography is localized extraction, which is helpful when determining the root cause of a contamination, in addition to potential long-term cleanliness and reliability concerns of low- or no-clearance components. Finally, ion chromatography can be used ...
Circuits Assembly Online Magazine - The Drive for Innovation
WEBAug 30, 2024 — The Drive for Innovation. Published: 30 August 2024. by Alun Morgan. On the cusp of 6G, are we also on the verge of a materials breakthrough? The world has barely experienced a fraction of the services 5G mobile promised to deliver, and already the drive toward 6G is gathering momentum. The standardization process begins this year, and the ...
Clarifying Through-Hole Fill Levels - Circuits Assembly
WEBOct 22, 2019 — At present, through-hole joint fill requirements and inspection criteria are commonly identified and understood within the J-STD-001/IPC-A-610 specifications. Those indicate Class II/III assemblies should have at least 75% fill, based on the through-hole depth. An oblique angle view x-ray clearly shows the nature and depth of the fill ...
System-in-Package and Multichip Module Technology
WEBJun 27, 2024 — SiP integrates multiple ICs, along with supporting passive devices, into a unified package, while the MCM represents a tightly coupled subsystem or module packaged together. An MCM can act as a cohesive unit, however, even though it may not encompass the entirety of the system’s functionality. Figure 1. A …
Understanding Electroless Nickel Thickness in ENIG and ENEPIG
WEBMar 31, 2023 — Calculation of Electroless Nickel coating thickness, using XRF, while complicated, can be simplified to a core principle, measuring the amount of mass of material within in a known measurement surface area. The measurement surface area is defined by either the collimator size or polycapillary optic spot size. An XRF instrument observes and quantifies an amount of mass of material(s), uses ...
Low-Temperature Solder: Challenges, Opportunities and …
WEBMar 1, 2024 — Low-temperature soldering (LTS) is a rapidly developing field with several potential benefits to the electronics industry. These benefits include reduced warping of components and substrates, lower energy consumption and reduced material costs. The lack of a standard solder alloy and the unique properties of emerging alloys, however, require development of new fluxes and processes for success.
Manncorp Intros IS-T-300 Selective Soldering System - Circuits …
WEBManncorp Intros IS-T-300 Selective Soldering System. Published: 10 February 2015. IS-T-300 all-in-one selective fluxing and soldering system comes with laser-controlled wave height compensation, jet-fluxing, and CAD data import. Handles double-sided and mixed technology PCBs up to 300 x 500mm, with an option for 460 x 700mm boards.
What is FAI, and What is the Purpose? - Circuits Assembly
WEBThe purpose of an FAI is to provide objective evidence that all engineering, design and specification requirements are correctly understood, accounted for, verified and recorded. 1. These are industry definitions of an FAI and its purpose; however, there is often confusion regarding the definition of a first article inspection and its ...
High-Density Interconnect Technology: An Overview - Circuits …
WEBFeb 1, 2024 — Edition Here! High-density interconnect (HDI) technology has been a major enabler of advancement in the electronics industry, providing the dense interconnections and intricate circuitry needed to create state-of-the-art electronic devices that are tightly packed with miniaturized components and 2.5-D/3-D semiconductor packages.