which complements the modular 3D sensor concept. With a factor of 1.8, the module is almost twice as fast as the previous 4K models of the C5 and MCS series, so that the measurement possibilities in ...

Abstract: The CREE 1200V/50A, 25mΩ 6-Pack SiC MOSFET module (CCS050M12CM2) is decomposed into a full 3D CAD model, and materials identified, for use in electrical circuit and multi-physics simulations ...

We extend the BEVFusion with the DifFUSER module to improve the robustness of multi-sensor fusion in 3D object detection and BEV segmentation. Diffusion models have recently gained prominence as ...

Abstract: This paper reports the design method, physical realisation, and experimental validation of a miniature current sensor for use on SiC power module terminals ... The design method uses 3D and ...