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A new PCB design can boost heat dissipation by 55x – copper coins placed under heat generating components drop temps drasticallyHeat dissipation is one of the problems that engineers ... "The newly developed stepped copper coin features a larger heat-dissipating area relative to the bonding surface with the heat-generating ...
Pioneering new research could help unlock exciting new potential to create ultrafast, laser-driven storage devices. The study ...
But when working on a more refined build you really need to calculate heat dissipation to ensure reliability. This is actually not tough at all. The numbers are right there in the datasheet.
Apple’s next-generation iPhone 17 Pro models are expected to house an advanced cooling technology, a vapor cooling chamber, which will help to improve the thermal performance of the upcoming A19 Pro ...
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