The development of new functional materials with tunable thermal conductivity offers solutions to challenges such as heat dissipation in electronic components. Among these devices of interest are ...
In the quest to design the next generation of materials for modern devices—ones that are lightweight, flexible and excellent ...
Pioneering new research could help unlock exciting new potential to create ultrafast, laser-driven storage devices. The study ...
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A new PCB design can boost heat dissipation by 55x – copper coins placed under heat generating components drop temps drasticallyis headed to markets where even the best air coolers are impractical – like miniature devices or applications in outer space. Heat dissipation is one of the problems that engineers involved with ...
In a highly digital way of life, laptops are indispensable devices for professionals, students, content generators, and ...
Newly published research demonstrates a novel way of generating phonon-polaritons by making electrons collide with crystal lattice structures. The discovery paves the way for cheaper, smaller ...
The work 'Hyperbolic phonon-polariton electroluminescence in 2D heterostructures', led by researchers at the US Advanced ...
“In addition, the poor thermal conductivity of materials used in finFET structures, and difficulty of heat dissipation to substrate from isolated fins surrounded by dielectric materials, results in ...
OnePlus might finally be working on a compact flagship. Multiple reports over the past few weeks have pointed to the ...
In the quest to design the next generation of materials for modern devices -- ones that are lightweight, flexible and excellent at dissipating heat -- a team of researchers made a discovery: ...
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