However, traditional two-dimensional (2D) microelectrode arrays (MEAs) used for monitoring these networks have limitations, particularly in stability and signal-to-noise ratio, which hinder long ...

A new technical paper titled “Energy-/Carbon-Aware Evaluation and Optimization of 3D IC Architecture with Digital Compute-in-Memory Designs” was published by researchers at Cornell University. “In ...

Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the first V-NAND product using 24 ...