It is no secret that Apple wants to own its hardware from start to end. This is why the company ditched Intel’s CPUs a few years ago and made its own series of Apple Silicon chips. The company is expected to debut the M5 chipset next year,

Unlike past SoCs, Apple is reportedly planning to separate the CPU and GPU in its upcoming M-series chips to take advantage of TSMC's latest chip-packaging technology, known as SoIC-mH.

According to reliable Apple analyst Ming-Chi Kuo, in a Medium post on Monday, Apple will utilize "server-grade SoIC [System-on-Integrated-Chip] packaging" in its M5 Pro, M5 Max, and M5 Ultra chips, excluding only the base M5 chip.

Apple will reportedly assemble the high-end M5 chips using 2.5D packaging. This is a chip design approach that places a processor’s compute modules atop a common base layer, or interposer. The interposer is itself a semiconductor that allows data to move between the chip’s other components.

Ming-Chi Kuo, a supply chain expert at TF International Securities, predicts that mass production of the M5 chip will begin in the first half of 2025. The M5 Pro and Ultra models will follow, entering production in the second half of 2025 and 2026,

The M5 chip is expected to enter mass production in H1 2025. With the Apple M4 series chips already out on the latest Macs, noted Apple analyst

A new report from Ming-Chi Kuo reveals some of the details on Apple's next-gen M5 chip, including some of the major changes coming.The Latest Tech News, Delivered to Your Inbox

Apple supply chain analyst Ming-Chi Kuo today outlined mass production timing for the M5 series of chips, which he expects to be used in both

One of the key elements of Apple’s A-series and M-series chips is the System-on-a-Chip (SoC) design which tightly integrates