In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are ...

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are ...

The Electronic Design Automation (EDA) industry is a mature industry, but it’s also one that is constantly changing. Each process node and packaging technology advancement places new demands and ...

When discussing product quality in integrated circuits (ICs), two key aspects are essential: time zero defects and reliability. These concepts help distinguish between issues that appear immediately ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Researchers from the University of Michigan and Sandia National Laboratory propose a nonvolatile electrochemical memory that can store and rewrite information at temperatures over 1100°F (600°C), ...

Flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process control; ...

A new technical paper titled “Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories” was published by ...

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

Enter Calibre DesignEnhancer (DE), Siemens’ analysis-based solution for enhancing design reliability and manufacturability.

A new technical paper titled “Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of ...